Inter Back sputter system
- The plasma cleaning process is combined .
- Shorten the trolley spacing and increase the utilization efficiency of target coating.
- The substrate can be fully coated and has the advantages of low PARTICLE process.
- It can cooperate with the auto-handing pick-and-place film and CIM plant planning.
- The operating platform is established to facilitate equipment maintenance.
- Customized coating effective area and specification structure to meet industrial process requirements.
- Metal sputter process / reactive sputter process / oxide sputter process
- Touch sensor / Optical / active and passive component / Chip EMI and other industries.