The machine is suitable for academic, research and industrial use.
The substrate size is 2~8 inch wafer.
Electron beam and thermal resistance evaporation source coating can be switched according to the process.
Electron beam and thermal resistance evaporation source coating can be in the central position according to customer requirements or live separately on both sides of the cavity.
Can accurately monitor the coating speed and thickness.
Customized machine design, which can be designed according to customer requirements
High market share.
High vacuum pumping speed, increasing machine productivity.
Plasma cleaning process or ion cleaning process can be done according to customer needs.
Process and industry:
Au-Sn alloy evaporation process / metal electrodes with different thicknesses switch coating
LED electrode metal-alloy coating / electronic component assembly coating
Research machines for academic and research circles
