Vacuum Sputter System of Load-Lock Type

  • The plasma cleaning process is combined.
  • Plan to vertical or horizontal type for multi-carrier loading function.
  • Customized design to meet process requirements.
  • Auto loading and unloading and CIM planning function included.
  • Equipment easy to maintenance.
  • Customized deposition effective area of carrier .
  • Metal sputter process / reactive sputter process / oxide sputter process.
  • Optical / active and passive component / hand phone / Chip EMI and other industries.