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Vacuum system
Vacuum evaporation system
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Cluster optical evaporation system
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ADL deposition system
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Company Profile
About
Management team
Business philosophy
Equipment advantages
History
News & Events
Product Information
Vacuum system
Vacuum evaporation system
Vacuum sputter system
Cluster optical evaporation system
Plasma clean system
ADL deposition system
Factory Affairs System and Engineering
Factory System and Engineering
Customer Service
Repair and maintenance
Consumables for sale
Equipment upgrade
Fu Cheng Optoelectronic
About FU CHENG OPTOELECTRONIC
Business item
Sales service network
Maintenance training base
Contact us
Company Profile
About
Management team
Business philosophy
Equipment advantages
History
News & Events
Product Information
Vacuum system
Vacuum evaporation system
Vacuum sputter system
Cluster optical evaporation system
Plasma clean system
ADL deposition system
Factory Affairs System and Engineering
Factory System and Engineering
Customer Service
Repair and maintenance
Consumables for sale
Equipment upgrade
Fu Cheng Optoelectronic
About FU CHENG OPTOELECTRONIC
Business item
Sales service network
Maintenance training base
Contact us
Company Profile
About
Management team
Business philosophy
Equipment advantages
History
News & Events
Product Information
Vacuum system
Vacuum evaporation system
Vacuum sputter system
Cluster optical evaporation system
Plasma clean system
ADL deposition system
Factory Affairs System and Engineering
Factory System and Engineering
Customer Service
Repair and maintenance
Consumables for sale
Equipment upgrade
Fu Cheng Optoelectronic
About FU CHENG OPTOELECTRONIC
Business item
Sales service network
Maintenance training base
Contact us
Contact
Electron beam evaporation system
Category :
Vacuum evaporation system
,
Vacuum system
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Electron beam + thermal evaporation system
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Feature of product:
The machine is suitable for academic, research and industrial use.
The substrate size is 2~8 inch wafer.
High production capacity in the industry.
Substrate water cooling mechanism, which can be used in low temperature substrate manufacturing process.
Customized machine design, which can be designed according to customer requirements.
High market share.
High vacuum pumping speed, increasing machine productivity.
Plasma cleaning process or ion cleaning process can be done according to customer needs.
Process and industry:
Metal evaporation process / oxide evaporation process / Au/Sn and other alloy evaporation process.
LED electrode/ITO oxide/MOSFET electrode.
Third-generation semiconductor electrode coating/academic and research industry research machine
Product Gallery:
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Related:
Plasma Clean System
Optical Cluster Evaporation System
Electron beam + thermal evaporation system
Vacuum Sputter System of Load-Lock Type