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Inter Back sputter system

  • Feature of product:
  • The plasma cleaning process is combined .
  • Shorten the trolley spacing and increase the utilization efficiency of target coating.
  • The substrate can be fully coated and has the advantages of low PARTICLE process.
  • It can cooperate with the auto-handing pick-and-place film and CIM plant planning.
  • The operating platform is established to facilitate equipment maintenance.
  • Customized coating effective area and specification structure to meet industrial process requirements.
  • Process and industry:
  • Metal sputter process / reactive sputter process / oxide sputter process
  • Touch sensor / Optical / active and passive component / Chip EMI and other industries.
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