LED is small in size, high in efficiency, fast in response time, longer in product life than other light sources, and does not contain mercury that is harmful to the environment. It is an energy-saving and environmentally friendly product of the times. Therefore, the LED industry has been emitting heat in recent years, the efficiency of light emission has increased day by day, and the cost of production has dropped significantly.
In order to effectively solve the problem of LED heat dissipation, various manufacturers are making every effort to develop new heat dissipation technologies. Among them, Diamond Like Carbon (Diamond Like Carbon) DLC has many superior material properties: high thermal conductivity, thermal uniformity, and high material strength, etc… If DLC can be applied to high-power LED packaging interface technology, LED PCB production The high temperature can be quickly brought to the heat sink of the inner and outer shell, and the outer shell generates radiant heat to achieve the purpose of heat dissipation and heat balance, and effectively improve the life, reliability, and light output of LED products. This new technology will be a new generation Technical indicators.
F.S.E Corporation has studied the field of vacuum technology for many years, and has excellent performance in various coating and etching applications. In 2010, it has successfully developed DLC CVD film forming equipment. At present, large-area a-C:H DLC equipment has been delivered to customers for mass production. The machine adopts a leaf-type mass production design and can carry 5~7 process chambers at the same time. The cluster has the most flexible design for different film thickness or product characteristics. The characteristics of the machine are as follows:
|Outer dimension (mm)||7000(L) x 8000(W) x 1800(H)|
|Substrate Size||700X550X4mm Al|
|Loading Function||Single sub. in/out|
|Transfer Unit||5.5G Vacuum Robot|
|Pre-heater Chamber||with IR Lamp|
|L/L chamber vacuum||Base Pressure:≤ 20 mTorr Leak Rate: ≤1 mTorr/min|
|Transfer chamber vacuum||Base Pressure:≤ 20 mTorr Leak Rate: ≤1 mTorr/min|
|DLC chamber vacuum||Base Pressure:<1×10-6 Torr Leak Rate: ≤0.5 mTorr/min|
|Process chamber Material||SUS316|
|Auto Pressure Control system||MKS 627B and VAT S65 series valve|
|Power supply||13.56MHz RF power supply|
|Gas Distribution||2-layer Shower head|
|Mass Flow Controller||AE MFC 7800 series for 6 channel|